MediaTek unveils first 3nm chipset in partnership with TSMC

Mediatek has announced the development of its first 3nm chipset based on Taiwan Semiconductor Manufacturing Company’s (TSMC) cutting-edge 3nm process technology. This new 3nm chipset is slated for its commercial debut in the upcoming year, the company said in a press release.

Joe Chen, President of MediaTek, has expressed the company’s steadfast dedication to harnessing state-of-the-art technology to enrich people’s lives in profound ways.

Chen said, “TSMC’s unwavering commitment to consistent and top-tier manufacturing capabilities empowers MediaTek to fully showcase its exceptional design prowess in flagship chipsets, thereby providing our global customers with top-notch performance and quality solutions, ultimately elevating the user experience in the flagship market.”

#MediaTek successfully develops the 1st chip w/ #TSMC's #3nm process, set for 2024 production. This milestone highlights our strategic partnership combining design & manufacturing strengths for high-performance, low-power SoCs to power global end devices. https://t.co/QiqpNPKN9g pic.twitter.com/X5GTQvJKDw

— MediaTek (@MediaTek) September 6, 2023

Dr. Cliff Hou, Senior Vice President of Europe and Asia Sales at TSMC, expressed, “The collaboration between MediaTek and TSMC on MediaTek’s Dimensity SoC signifies that the capabilities of the industry’s most advanced semiconductor process technology can now be as accessible as the smartphone in one’s pocket. Over the years, there has been a close working relationship between TSMC and MediaTek, resulting in the introduction of several significant innovations to the market. We are pleased to continue this partnership into the 3nm generation and beyond.”

According to MediaTek, TSMC’s 3nm process technology offers significant improvements in performance, power efficiency, and yield, while also providing comprehensive support for high-performance computing and mobile applications.

When compared to TSMC’s N5 process, the 3nm technology currently delivers impressive benefits, including up to an 18% increase in speed at the same power level, a remarkable 32% reduction in power consumption at the same speed, and a substantial approximately 60% boost in logic density.

MediaTek said that its Dimensity SoCs, which utilise this cutting-edge process technology, have been carefully designed to address the constantly evolving needs of users in the realms of mobile computing, high-speed connectivity, artificial intelligence, and multimedia experiences.

The impending introduction of MediaTek’s inaugural flagship chipset incorporating TSMC’s 3nm process is expected to provide enhanced capabilities to a wide range of devices, such as smartphones, tablets, intelligent vehicles, and more. Its availability is scheduled to commence in the latter half of 2024.